Soldering A to Z

Type of solder paste

  1. Alloy 106KB
  2. Solder paste flux 106KB

Practicality of solder paste

  1. Printing machine 696KB
    1. Stencil
    2. Squeegee
    3. Parameters
    4. Mixing conditions
  2. Workability 220KB
    1. Stencil idle time
    2. Stencil life
    3. Tackiness
    4. Hear slump
    5. Surface treatment
  3. Solderability 132KB
    1. Wetting
    2. Solder balling
    3. Voiding
    4. Flux spattering
    5. Bridging
  4. Reflow profile 203KB
  5. Reliability ---KB
  6. Inspection ---KB
    1. Visual check
    2. ICT test
    3. Resistance to cracking
  7. Needs for N2 reflow ---KB
  8. Pin-in process 205KB
  9. Dispensing ---KB
  10. PoP 277KB

Trouble shooting

  1. In printing process ---KB
    1. Scrapping
    2. Excessive solder
    3. Dog ear
    4. Slumping
    5. Poor stencil separation
    6. Poor squeegee separation
  2. After reflow process ---KB
    1. Bridge
    2. Side balls
    3. Solder balls
    4. Tomb stone
    5. Unmelted solder
    6. Whisker
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