Low curing temperature SMT adhesive

JU-90-2LTH

Energy-saving adhesive curing at 90℃　Reduces thermal stress

Environmental and energy-saving

Lower curing temperature contributes to reducing energy consumption and cost, which results in less CO2 emissions.

■Electricity consumption of curing oven / hr.

Reduces oxidation of components and substrate

JU-90-2LTH cures at temperatures as low as 90ºC, reducing the level of oxidation for the components and substrate. It enables improvement in the overall product quality and the first time quality.

■Influence of heat damage

As strong as conventional models

The most important element of adhesive is the bonding strength. JU-90-2LTH reduces the curing temperature without sacrificing its bonding strength.

■Bonding strength cured at 90℃

Product Performance Table

Product Name
JU-90-2LTH
Product Category
Heat Curable SMT Adhesive
Composition
Epoxy
State / Color
Paste / Red
Viscosity（Pa.s）
65
Tg（℃）
49〜74
Curing condition
90℃ × >90sec.
Shelf life (0-10℃)
Below 10ºC, 6 months

You have question?

Inquiry Form