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Name Date Place Co-exhibitor
SMT/HYBRID/
PACKAGING 2010		 Jun. 8 to 10, 2010
Booth #9-629, Nuernberg,
GERMANY		 Koki Deutchland
→ Proposing total solution for 0402 package with FUJI
  Koki, together with Fuji Machine MFG, is proposing a full range solution, from hardware
to software, for high density package such as 0402 type chip component.
Come find out the details at FUJI booth in the following exhibitions!
Name Date Place
ICP APEX EXPO Mar. 31 to Apr. 2, 2009 Mandalay Bay Resortand Convention
Center,Las Vegas, Nevada,U.S.A
NEPCON China Apr. 21 to 24, 2009 Shanghai Everbright Convention and
Exhibition Center, China
JISSO/PROTEC 2009 Jun. 3 to 5, 2009 Tokyo Big Sight,
Tokyo,　Japan
Productronica 2009 Nov. 10 to 13, 2009 New Munich Trade Fair Centre
Munich, Germany
 
 
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