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| Top > Exhibition |
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Koki, together with Fuji Machine MFG, is proposing a full range solution, from hardware to software, for high density package such as 0402 type chip component. Come find out the details at FUJI booth in the following exhibitions! |
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| Name |
Date |
Place |
| ICP APEX EXPO |
Mar. 31 to Apr. 2, 2009 |
Mandalay Bay Resortand Convention Center,Las Vegas, Nevada,U.S.A |
| NEPCON China |
Apr. 21 to 24, 2009 |
Shanghai Everbright Convention and Exhibition Center, China |
| JISSO/PROTEC 2009 |
Jun. 3 to 5, 2009 |
Tokyo Big Sight, Tokyo, Japan |
| Productronica 2009 |
Nov. 10 to 13, 2009 |
New Munich Trade Fair Centre Munich, Germany |
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Copyright (C)2005 KOKI Company Ltd. / All rights reserved.
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