New products

PREVENTS the occurrence of HIDDEN PILLOW DEFECT.

Drastically REDUCES VOIDING expecially with large contact area components.

Significant REDUCTION of HALOGEN from the flux formation helps to prevent environmental pollution.

Sn0.1Ag0.7Cu0.03Co offers vastly improved solder joint RELIABILITY.

ANTI PILLOW DEFECT formulation.

Halogen FREE, low voiding.

Specially developed flux system ensures EXCELLENT and CONSISTENT ICT TESTABILITY.

Carefully selected flux chemistry ensures extremely LOW VOID formation.

True HALOGEN free and meet a halogen free requirement (Br/Cl: <900ppm each, total: <1500ppm)

PREVENTS the occurrence of HIDDEN PILLOW DEFECT and ensures the quality of solder joints.

Ensures OUTSTANDING continual PRINTABILTIY with super fine pitch and CSP applications and has long stencil idle time.

Heat RESISTANT new flux formula achieves complete solder melting and wetting on micro-components and footprints.

Ensures OUTSTANDING continual PRINTABILITY with super fine pattern applications (0.5mm pitch CSP, 0402 components) and long stencil idle time.

Designed to cope with super fine pattern application, e.g. <0.2mm diameter CSP pattern, and ensures PERFRECT WETTING and COALESCENCE.

Specially formulated flux chemistry ensures extremely LOW VOIDING with CSPs and broad contact area components.

Solder alloy composition is SnAg3.5Bi0.5In6 with melting point 202~211ºC.

Realizes LOW REFLOW TEMPERATURE than SnAgCu solder paste.
Specially developed flux system PREVENTS EXCESSIVE REACTION with solder alloy and ensures stable and consistent performance.

PERFECT MELTING and WETTING by reflow in AIR.

Solder alloy composition is Sn42.0Bi58.0 with melting point 138ºC.

Allows the use of LOWER reflow temperature than normally used for Tin/Lead solders.
Greatly helps reduce the emissions of CO2. ANTI-GLOBAL WARMING solder paste.