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Lead free - No-clean solder pastes

Koki offers range of high performance lead-free solder pastes with high purity non-oxidized solder powders.

Specially developed high temperature resistant no-clean flux systems ensure as high soldering quality as conventional lead containing solder pastes realizing excellent fine pitch and micro components printability, and powerful solderability even in air reflow.

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■ General products

Product Number	Grain Size (melting point)	Application	Pdf
S3X48-M500	Sn96.5/Ag3/Cu0.5 (217~218°C)	Anti-Pillow Defect Halogen Free Low Voiding	(1,920KB)
S3X48-M406-5		General purposes Anti-pillow defect Excellent printability	(824KB)
S3X58-M650-3		Halogen free ICT testable For high speed print	(513KB)
S3X70-M500		For Super fine pitch (0402 Chip) Grain size: 10~25um	(Coming soon)
S01X7C48-M500	Sn99.17/Ag0.1/Cu0.7/Co0.03 (217～227°C)	Low Ag Anti-pillow defect	(679KB)
SB6N58-A730-3	Sn90/Ag3.5/Bi0.5/In6 (202～210°C)	Medium melting point Anti-crack alloy (High durability)	(1,467KB)
TB48-M741	Sn42/Bi58 (138°C)	Low melting point Anti-Global Warming (Reduce the emissions of CO2)	(546KB)

■ For PoP

Product Number	Grain Size (melting point)	Application	Pdf
S3X811-NT1	Sn96.5/Ag3/Cu0.5 (217～218°C)	Outstanding stability of smoothening Ensure consistent amount of solder paste Grain size: 5~20um	(coming soon)

■ For wafer bumping

Product Number	Grain Size (melting point)	Application	Pdf
S3X-BF70M	Sn96.5/Ag3/Cu0.5 (217～218°C)	For super fine bump size (100μmφ) High cleaning performance Customizable as customerÃÔ condition Grain size: 5～20um	(coming soon)
S3X-BF200N	Sn96.5/Ag3/Cu0.5 (217～218°C)	For ordinary bump size (250μmφ) High cleaning performance Grain size: 20~38um	(coming soon)