| Product |
Curing condition |
Shelf life (0-10°C) |
Application |
Pdf |
| JU-50UF |
130°C x
10 min. |
3 mo. |
Underfill for SMT process
Halogen free product
High osmosis ability |
(coming soon) |
| JU-R2S |
Preheat:
150-190°C
x100 sec.
Reflow temp:
above 220°C
x45 sec. |
6 mo. |
Adhesive for SMT process
Self alignment effect with lead free solder |
(1,405KB) |
| JU-100-2LH |
130°C x
60 sec. |
Halogen free product
Stable dispensability |
(coming soon) |
| JU-90LT |
90-100°C x
100 sec. |
Low temperature curable product |
(478KB) |
| JU-100-5 |
130°C x
60 sec. |
Excellent dispensability for low to high speed dispensing |
(267KB) |
JU-41P
JU-44P |
130°C x
60 sec. |
Excellent printing with high dot profile |
(393KB) |
