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Halogen Free series
Lead free - No-clean Solder pastes
Lead free - No-clean wave soldering fluxes
Lead free - No-clean flux cored wire solders
Lead free process use - SMT Adhesive JS-R2S
Lead containing - No-clean Solder pastes
Lead containing - No-clean wave soldering fluxes
Lead containing - No-clean Flux cored wire solder JM-20
Leaded process use - SMT Adhesives
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Top > Product information > Lead containing– SMT adhesives

Leaded & lead free process use - SMT adhesives

A range of epoxy based adhesives ensures extremely stable hi-speed dispensability whilst significantly improving bonding strength.
Adhesives suitable for low curing temperature and printing applications are also available.

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Product Inquiry
Product Curing condition Shelf life (0-10°C) Application Pdf
JU-R2S Preheat:
150-190°C
x100 sec.
Reflow temp:
above 220°C
x45 sec.		 6 mo. Adhesive for SMT process
Self alignment effect with lead free solder		 PDF icon
(1,405KB)
JU-100-2LH 130°C x
60 sec.		 Halogen free product
Stable dispensability		 PDF icon
(coming soon)
JU-90LT 90-100°C x
100 sec.		 Low temperature curable product PDF icon
(478KB)
JU-100-5 130°C x
60 sec. 		Excellent dispensability for low to high speed dispensing PDF icon
(267KB)
JU-41P
JU-44P		 130°C x
60 sec.		 Excellent printing with high dot profile PDF icon
(393KB)
 
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