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Halogen Free series
Lead free - No-clean Solder pastes
Lead free - No-clean wave soldering fluxes
Lead free - No-clean flux cored wire solders
Lead free - SMT Adhesive JS-R2S
Lead containing - No-clean Solder pastes
Lead containing - No-clean wave soldering fluxes
Lead containing - No-clean Flux cored wire solder JM-20
Lead containing - SMT Adhesives
NEW Products

Environmental policy
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Halogen Free Products

Recent increasing consciousness about ecology on a global scale has started considerations for the restriction of certain elements within soldering materials used within the electronics industry.
Ever since it has been reported that dioxins can be generated when specific kinds of halide are combusted, there have been moves afoot to eliminate halogens from soldering materials.
Koki research and development team have been working on this Halogen free issue for many years, and offers true Halogen free solder pastes.

ECO+PLUS

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Halogen Free
Substance Permissible limit (by weight)
Bromine (Br) ≤ 900ppm (0.09%)
Chlorine (Cl) ≤ 900ppm (0.09%)
Total concentration of Cl + Br

≤ 1500ppm (0.15%)

Download PDF File:

Product type Product Alloy composition
(melting point)
Application Pdf
No-clean
solder paste
S3X48-M500-2

Sn3.0Ag0.5Cu

(217~219℃)

- Optional alloys -

S01X7C

(Sn0.1Ag0.7Cu0.03Co)

S1X7C

(Sn1.0Ag0.7Cu0.03Co)

Low voiding
Anti-pillow defect
PDF icon
(398KB)
S3X70-M500
S3X70-M500D
Sn3.0Ag0.5Cu
(217~219℃)
For fine patterns
M500D for dispensing
PDF icon
(247KB)
TB48-M742 Sn58.0Bi
(138℃)
Low melting point PDF icon
(321KB)
SB6N58-M500SI
SB6N58-M500SID
Sn3.5Ag0.5Bi6.0In
(202~210℃)
Anti-cracking alloy
M500SID for dispensing
PDF icon
(282KB)
No-clean
solder wire
S3X-60NH Sn3.0Ag0.5Cu
(217~219℃)
Improved workability PDF icon
(245KB)
No-clean
wave soldering
flux
JS-EU-31 --- Low flux residue
Superior total
performance
PDF icon
(423KB)
 
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