| Product type |
Product |
Alloy composition (melting point) |
Application |
Pdf |
No-clean solder paste
|
S3X48-M500 |
 |
Low voiding Anti-pillow defect Powerful wetting |

(1,920KB)
|
| S3X48-M650-3 |
Low voiding ICT testable For high speed print |

(844KB)
|
S01X7C48-M500 |
Sn99.17/Ag0.1/Cu0.7/Co0.03 (217~227℃) |
Low Ag Anti-pillow defect High reliability |

(679KB)
|
No-clean wave soldering flux
|
JS-EU-31 |
--- |
Low flux residue Superior total performance |

(445KB)
|
No-clean solder wire
|
S3X-60NH |
 |
Improved workability |

(coming soon)
|
| Adhesive
|
JU-100-2LH |
--- |
For medium and high speed dispensing |

(coming soon)
|