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Until last year, solders have been seriously affected by.....
Over the last few years, there has been an increase in the rate of Head-in-Pillow component.....
Since the Waste Electrical and Electronic Equipment (WEEE) and.....
As the use of Sn3.0Ag0.5Cu solder to replace the conventional SnPb becomes more common due in part to a recommendation by JEITA, most users designate this alloy.....
New lead free solder wire improves quality and reduces solder tip consumption.....
Using mobile telephones as a typical example, whilst downsizing of the electronic devices continues, more and more space saving components, such as BGAs and CSPs,.....
As the European Restriction of Hazardous Substances (RoHS) directives come into force in July 2006, the transition to lead-free solder is being made at an increasingly rapid pace.....
Within all EU member state countries, forthcoming legislation will control the manufacture, and disposal of electrical or electronic equipment sold within the community countries.....
Whilst it is important to select a modern Lead Free Solder Paste with sustained activity with a superior thermally stable activator package to withstand the harsher reflow profiles required for Lead Free soldering.....
In the transition period from leaded solder to lead free solder process, it shall be inevitable sometimes that leaded components are soldered by lead free solder. In this memo you will find the potential risk in case such alloy combination is used.....
Design of reflow thermal profiles are very dependant on the components mounted on the board, and this specific application investigates the issue where two types of very commonly available BGA packages are mounted on the same assembly..... |
