Solder paste to meet your needs: KOKI

	S3X48-M500C Sn3.0Ag0.5Cu Anti-Pillow & Low Voiding solder paste. Drastically reduces voiding and ensures the highest quality of solder joints

	S01X7C48-M500C Sn0.1Ag0.7Cu + Co alloy offers vastly improved solder joint reliability. Prevents the occurrence of the hidden pillow defect and ensures the highest quality of solder joints.

	T4AB58-M742 Sn57.6Bi0.4Ag Halogen Free solder paste with Low Melting Point. Effective in saving the use of electricity and reducing Co2 emission. ››› Halogen Free

	SB6N58-M500SI Sn3.5Ag0.5Bi6In medium melting point solder paste, designed to be used for automotive applications

	S3X58-CF100 Sn3.0Ag0.5Cu Crack-Free flux residue solder paste. Applicable for air reflow - an industry first unique to Koki

	GSP Sn3.0Ag0.5Cu solder paste developed in collaboration with a leading automaker. Crack-free flux residues achieve very high reliability

	S3X-70M Sn3.0Ag0.5Cu solder wire applicable for REACH compliance. Remarkable wetting performance.

	S03X7Ca-70M Sn0.1Ag0.7Cu + Co Low Ag solder wire. Drastically extends the iron tip life. ››› Low-Ag wire solder

	JS-E-15X Good wetting, high reliability wave soldering flux.

	2012.2.2 Come find Koki's letest product lineup at APEX EXPO in San Diego, to be held from Feb. 28 - Mar. 1, 2012. Christopher Associates, our sales agent, will take part.

	2012.2.2 Thank you for visiting us at INTERNEPCON JAPAN. Check out our new products here.

	2011.1.14 New technical resources have been added to Technical memo. You can now read papers on Lead-free solder paste for PoP manufacturing applications, and on solder pastes to reduce voiding in large contact area components.

Quality management system ISO9001:2000
Environmet management system ISO14001
(Higashimatsuyama plant)