S3X48-M500 Sn3.0Ag0.5Cu Anti-Pillow Defect, Halogen Free solder paste. Drastically reduces voiding and ensures the highest quality of solder joints ››› Halogen Free   S01X7C48-M500 Sn0.1Ag0.7Cu0.03Co+X alloy offers vastly improved solder joint reliability. Prevents the occurrence of the hidden pillow defect and ensures the highest quality of solder joints. ››› Halogen Free   S3X58-M650-3 Sn3.0Ag0.5Cu Halogen Free solder paste with excellent and consistent ICT testability. True halogen free and meet a halogen free requirement. ››› Halogen Free   S03X7Ca-56M Newly invented Anti-Erosion alloy greatly extends iron tip life. Fast wetting and least spattering. ››› Low-Ag wire solder   S3X70-M407-4 Sn3Ag0.5Cu Super fine pattern (0.4x0.2mm chip) use solder paste (Type 5 solder powder, powerful wetting, low voiding)   SB6N58-A730-3 Sn3.5Ag0.5Bi6In medium melting point solder paste (Realizes low reflow temperature , robust solder joints)   TB48-M741 Sn42.0Bi58.0 low melting point solder paste Anti-global warming by reducing the emissions of CO2.   2010.2.17 Don't miss the chance to find our latest solder paste of high-reliability, thermal shock resistant solder alloy. 2nd LED/OLED Lighting Technology Expo Apr. 14 - 16, 2010 at Tokyo Big Sight, Japan 2010.2.12 Bergen Associates, Koki's sales agent in India, will participate in ELECTRONICS NEXT INDIA 2010. Feb. 24 - 26, 2010 at Pragati Maidam, New Dehli 2010.1.25 Thank you for visiting us at INTER NEPCON JAPAN. Among other new products, we received most inquiries on high-reliability solder allow, S-051. Further information of the product is coming soon.       Quality management system ISO9001:2000 Environmet management system ISO14001 (Higashimatsuyama plant)

Copyright (C)2005 KOKI Company Ltd. / All rights reserved.