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NEW Products
→ Solder paste  S3X48-M500
Sn3.0Ag0.5Cu Anti-Pillow Defect, Halogen Free solder paste.
Drastically reduces voiding and ensures the highest quality of solder joints

››› Halogen Free
→ Solder paste  S01X7C48-M500
Sn0.1Ag0.7Cu0.03Co+X alloy offers vastly improved solder joint reliability. Prevents the occurrence of the hidden pillow defect and ensures the highest quality of solder joints.

››› Halogen Free
→ Solder paste  S3X58-M650-3
Sn3.0Ag0.5Cu Halogen Free solder paste with excellent and consistent ICT testability. True halogen free and meet a halogen free requirement.

››› Halogen Free
→ Solder wire  S03X7Ca-56M
Newly invented Anti-Erosion alloy greatly extends iron tip life.
Fast wetting and least spattering.

››› Low-Ag wire solder
→ Solder wire  S3X70-M407-4
Sn3Ag0.5Cu Super fine pattern (0.4x0.2mm chip) use solder paste (Type 5 solder powder, powerful wetting, low voiding)
→ Solder paste  SB6N58-A730-3
Sn3.5Ag0.5Bi6In medium melting point solder paste (Realizes low reflow temperature , robust solder joints)
→ Solder paste  TB48-M741
Sn42.0Bi58.0 low melting point solder paste
Anti-global warming by reducing the emissions of CO2.
 
What's new
→ 2010.4.27
Koki Deutchland will participate in SMT/HYBRID/PACKAGING 2010,
an event for System Integration in Micro
Electronics, from June. 8 - 10, 2010 at Nuernberg, Germany.
Don't miss it!
 
Technical meno
 
Patent information
 
ECO+PLUS
Halogen Free series
Solder paste
Wave soldering flux
Solder wire
Adhesive
 
ISO
Quality management system ISO9001:2000
Environmet management system ISO14001
(Higashimatsuyama plant)
 
Environmetal policy
 
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