S3X48-M500C
Sn3.0Ag0.5Cu Anti-Pillow & Low Voiding solder paste.
Drastically reduces voiding and ensures the highest quality of solder joints
S01X7C48-M500C
Sn0.1Ag0.7Cu + Co alloy offers vastly improved solder joint reliability. Prevents the occurrence of the hidden pillow defect and ensures the highest quality of solder joints.
T4AB58-M742
Sn57.6Bi0.4Ag Halogen Free solder paste with Low Melting Point. Effective in saving the use of electricity and reducing Co2 emission.
››› Halogen Free
SB6N58-M500SI
Sn3.5Ag0.5Bi6In medium melting point solder paste, designed to be used for automotive applications
S3X58-CF100
Sn3.0Ag0.5Cu Crack-Free flux residue solder paste.
Applicable for air reflow - an industry first unique to Koki
GSP
Sn3.0Ag0.5Cu solder paste developed in collaboration with a leading automaker.
Crack-free flux residues achieve very high reliability
S3X-70M
Sn3.0Ag0.5Cu solder wire applicable for REACH compliance.
Remarkable wetting performance.
S03X7Ca-70M
Sn0.1Ag0.7Cu + Co Low Ag solder wire.
Drastically extends the iron tip life.
››› Low-Ag wire solder
JS-E-15X
Good wetting, high reliability wave soldering flux.
2012.2.2
Come find Koki's letest product lineup at APEX EXPO in San Diego, to be held from Feb. 28 - Mar. 1, 2012.
Christopher Associates, our sales agent, will take part.
2012.2.2
Thank you for visiting us at INTERNEPCON JAPAN.
Check out our new products here.
2011.1.14
New technical resources have been added to Technical memo.
You can now read papers on Lead-free solder paste for PoP manufacturing applications, and on solder pastes to reduce voiding in large contact area components.
Quality management system ISO9001:2000
Environmet management system ISO14001
(Higashimatsuyama plant)
Copyright (C)2005 KOKI Company Ltd. / All rights reserved.