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- Technical Memo >
- Diversifying low Ag solders
Diversifying low Ag solders
2014.5.29
SAC305(Sn, Ag3.0%, Cu0.5%) has long been the main stream of lead free solder alloy composition.
The alloy composition costwise is vulnerable to metal price fluctuation as Ag, often traded for investment purposes, accounts for a large portion of its cost composition. For that reason, market demands are growing for the solder materials with lower Ag content.
Here in this technical memo, we will discuss the advantages of having low Ag in the solder, its disadvantages and how to improve them, elements for the improvements, and their mechanism.
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