- HOME >
- Technical Memo >
- On Wetting and Activation of the Solder Paste
On Wetting and Activation of the Solder Paste
2015.9.15
Demand for low-cost materials in the market can lead to poor-quality electrical components and PCBs in deteriorated condition.
These components and PCBs tend to build up thick oxidized film on their surface and could become a cause of soldering failure.
The paper introduces a high wettability solder paste for various degraded materials, and explain the mechanism of good solder wetting.
These components and PCBs tend to build up thick oxidized film on their surface and could become a cause of soldering failure.
The paper introduces a high wettability solder paste for various degraded materials, and explain the mechanism of good solder wetting.
To read the full text of this article, please send a request from the “Form” button below.
You have question?