On Wetting and Activation of the Solder Paste


Demand for low-cost materials in the market can lead to poor-quality electrical components and PCBs in deteriorated condition.
These components and PCBs tend to build up thick oxidized film on their surface and could become a cause of soldering failure.
The paper introduces a high wettability solder paste for various degraded materials, and explain the mechanism of good solder wetting.

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