Demand for low-cost materials in the market can lead to poor-quality electrical components and PCBs in deteriorated condition. These components and PCBs tend to build up thick oxid
Demand for low-cost materials in the market can lead to poor-quality electrical components and PCBs in deteriorated condition. These components and PCBs tend to build up thick oxid
Trend on Halogen Free Soldering Material Halogen Free (HF) has become one of the major requirements in Electric/ Electronics Industry in order to reduce the environmental impac
2015.5.25
Preface Koki has been providing “Defect Analysis Service” to determine the root cause of the various defects experienced by our valued customers upon request as a part of custo
Introduction Electrical and electronic products today have multiple functions and are composed of various different electric components. Consumer electrical products may swift
Abstract Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP compo
Until last year, solders have been seriously affected by the high cost of metal materials. At present, the SAC305 (Sn-3mass%Ag-0.5mass%Cu) is the mainstream lead-free solder. Its
2014.5.29
SAC305(Sn, Ag3.0%, Cu0.5%) has long been the main stream of lead free solder alloy composition. The alloy composition costwise is vulnerable to metal price fluctuation as Ag, ofte
As the use of Sn3.0Ag0.5Cu solder to replace the conventional SnPb becomes more common due in part to a recommendation by JEITA, most users designate this alloy type of flux-cored
2012.12.23
Using mobile telephones as a typical example, whilst downsizing of the electronic devices continues, more and more space saving components, such as BGAs and CSPs, are being widely
Joint Cracking the Problem?As the European Restriction of Hazardous Substances (RoHS) directives come into force in July 2006, the transition to lead-free solder is being made at a
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