Join us at 48th INTERNEPCON JAPAN
Come find our latest developments at:
48th INTERNEPCON JAPAN
16 - 18 January, 2019
Tokyo Big Sight, JAPAN
Booth No. E4-17
Products to be introduced at KOKI booth include
- Advanced low void solder paste
- High reliability alloy halogen free solder paste
- Low flux splattering HF solder paste
- High reliability HF solder paste for narrow gap patterns
and more.
See you at KOKI booth, INTERNEPCON JAPAN!