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Join us at 48th INTERNEPCON JAPAN


Come find our latest developments at:

48th INTERNEPCON JAPAN
16 - 18 January, 2019
Tokyo Big Sight, JAPAN
Booth No. E4-17

Products to be introduced at KOKI booth include
- Advanced low void solder paste
- High reliability alloy halogen free solder paste
- Low flux splattering HF solder paste
- High reliability HF solder paste for narrow gap patterns
and more.

See you at KOKI booth, INTERNEPCON JAPAN!

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