Visit KOKI booth at 34th Internepcon Japan in Tokyo
On exhibit are high-performance solder pastes with a variety of features such as super low voiding, powerful wetting, and fine patter applicability. In addition, a new high reliability alloy solder paste will also be introduced.
Mr. Takehiro Wada of KOKI will speak about the new high reliability alloy in a technical seminar titled
”Approach to the issues with high reliability solder allow"
in the exhibitors' presentation session. *Prior application not required.
For power device application, you can find new lineup with leaded alloy and ones for dispensing application, adding to the current alloy variation and printing application at the show.
Visitor tickets are available upon request, please contact us using the inquiry form in such a case.
Meet us at our booth, and find out more in detail and in person about our new products!