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Koki will take part in 36th Internepcon Japan, Tokyo



KOKI Company Limited is proud to announce its participation in 36th INTERNEPCON JAPAN,
to be held from 19th to 21st of January, 2022 at Tokyo Big Sight, Tokyo, Japan.

Products to be introduced are:

For SMT application, multi-feature halogen free solder paste S3X58-HF1100 and S3X70-HF1100, and newly developed high-reliability alloy composition soldering materials HR6A58-G820N, HR6A58-G370N, and HR6A-72M.

For power device application, lead free solder paste for oxidation-reduction vacuum reflow process E12 series.


Visitor tickets are available upon request.

Contact us through the inquiry on this webpage, or request e-ticket from the Nepcon Japan website.

Please come visit our booth, and find out more in detail and in person about our latest products!


36th INTERNEPCON JAPAN
Tokyo Big Sight, Tokyo, Japan
January 19 - 21, 2022
KOKI stand: East Hall, 5-30

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