Low melting point solder paste

TB48-M742
Sn 58.0Bi

Reliable and workable in low temperature reflow

Energy-saving

By reducing the required reflow profile temperature, electricity consumption can be reduced by approximately 40% compared to SAC305.
Reduction of electricity consumption results in reduction in CO2 emissions, achieving both energy saving and environmental care.

■Electricity consumption / hr.during reflow process(kw)

Reduces thermal damage to components and substrate

Energy saving is not the only benefit of a low temperature reflow profile. A low temperature profile reduces thermal damage to components during double-sided reflow and allows for use of heat-sensitive paper phenolic substrates.

■Joint conditions after reflow

High insulation reliability

The flux solvent volatilizes even in low temperature reflow, eliminating reduction in insulation resistance arising from inadequate volatilization. TB48-M742・T4AB48/58-M742 produces flux residue with high insulation reliability.

■Voltage applied SIR

Product Performance Table

Product Name
TB48-M742
Product Category
Solder Paste
Melting Point(℃)
138
Particle Size(μm)
20-38 / 20-45
Viscosity(Pa.s)
190
Flux Content(%)
10.0
Halide content(%)
0
Flux Type
ROL0 (IPC J-STD-004A)

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