Low melting point solder paste

T4AB58-M742
T4AB58-M742D
Sn 57.6Bi 0.4Ag

Reliable and workable in low temperature reflow

Energy-saving

By reducing the required reflow profile temperature, electricity consumption can be reduced by approximately 40% compared to SAC305.
Reduction of electricity consumption results in reduction in CO2 emissions, achieving both energy saving and environmental care.

■Electricity consumption / hr.during reflow process(kw)

Reduces thermal damage to components and substrate

Energy saving is not the only benefit of a low temperature reflow profile. A low temperature profile reduces thermal damage to components during double-sided reflow and allows for use of heat-sensitive paper phenolic substrates.

■Joint conditions after reflow

High insulation reliability

The flux solvent volatilizes even in low temperature reflow, eliminating reduction in insulation resistance arising from inadequate volatilization. TB48-M742・T4AB48/58-M742 produces flux residue with high insulation reliability.

■Voltage applied SIR

Also Available For Dispensing Application

Stable dispense performance of T4AB58-M742D allows efficient product usage.
Designated flux composition satisfies both meltability and low void occurrence from the chip-size packages to large components.

Product Performance Table

Product Name
T4AB58-M742 / T4AB58-M742D
Product Category
Solder Paste
Composition
Sn 57.6Bi 0.4Ag
Melting Point(℃)
138-140
Particle Size(μm)
20-38
Viscosity(Pa.s)
190
Flux Content(%)
10.0
Halide content(%)
0
Flux Type
ROL0 (IPC J-STD-004A)

You have question?

Inquiry Form