Improved application precision No Un-regulated hazardous substances
Tall deposits ensure contact with components
JU-110 has excellent shape retention, enabling continual application of tall print deposits. Therefore, contact with surface-mounted components of any shape is achieved, improving reliability of the wave soldering process.
Resistant to heat slump
JU-110 is strong against heat slump, maintaining the height of deposits throughout the process. The height of deposits and contact with surface-mounted components are maintained even during heating, securely immobilizing the components.
High precision continual printing
In addition to its resistance to heat slump, the viscosity of JU-110 is stable at room temperature. Consistent viscosity reduces print clogging and ensures highly precise continual printing.
Product Performance Table
- Product Name
- Product Category
- Heat Curable SMT Adhesive
- State / Color
- Paste / Red
- Transition Temperature(℃)
- Curing condition
- 130℃ × >60sec.
- Shelf life (0-10℃)
- Below 10ºC, 6 months