Energy-saving adhesive curing at 90℃ Reduces thermal stress
Environmental and energy-saving
Lower curing temperature contributes to reducing energy consumption and cost, which results in less CO2 emissions.
Reduces oxidation of components and substrate
JU-90-2LTH cures at temperatures as low as 90ºC, reducing the level of oxidation for the components and substrate. It enables improvement in the overall product quality and the first time quality.
As strong as conventional models
The most important element of adhesive is the bonding strength. JU-90-2LTH reduces the curing temperature without sacrificing its bonding strength.
Product Performance Table
- Product Name
- Product Category
- Heat Curable SMT Adhesive
- State / Color
- Paste / Red
- Transition Temperature(℃)
- Curing condition
- 90℃ × >90sec.
- Shelf life (0-10℃)
- Below 10ºC, 6 months