Rosin-free wave soldering flux with low residue

JS-EU-02

Excellent solderability with "Ultra Low Flux Residue"

Perfect for flow soldering with short pre-heating

Adding a small amount of resin instead of rosin widened the temperature range in which the flux remains fluid. JS-EU-02 is suitable for soldering using space-saving flowing machines where pre-heating tends to be inadequate.

■KOKI TECH EQSS-350SD

Reduces bridging and balls

Outflow of flux solid contents under the heat and pressure of waving is reduced to the minimum, maintaining consistent solder workability for a long period of time. Solder bridging and balling will be remarkably reduced.

■Bridging(Left) Solder balling(Right)

Special resin added for a cleaner finish

By adopting special resin in addition to the main organic acid normally used in organic acid type flux, JS-EU-02 realizes a low-residue non-sticky finish where flux residue after soldering is hardly visible.

Product Performance Table

Product Name
JS-EU-02
Product Category
Liquid Flux for Wave / Selective Soldering
Solid Content(%)
2.8
Specific gravity (at 20℃)
0.795
Halide content(%)
0
Flux Type
ORL0 (IPC-J-STD-004A)
Application
Spray
Purpose of Use
Wave soldering

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