Wave soldering flux for wire finishing

JS-C.1G

Solder plating for copper wires

Protects copper wires from oxidation and corrosion

Soldering raw copper wires using flux-cored solder etc. may cause oxidation of the copper wires due to the heat or corrosion due to flux residue. Pre-treating copper wires using JS-C.1G eliminates such concerns, and improved solderability can also be expected.

■Before plating

Ultra-low residue enables no cleaning

JS-C.1G achieved ultra-low residue by eliminating everything other than the components really necessary for treatment of copper wires. Pre-treated wires can be used without cleaning, because there is no residue interfering with the solderability or conductivity.

■After plating

Product Performance Table

Product Name
JS-C.1G
Product Category
Liquid Flux for Wave / Selective Soldering
Solid Content(%)
2.0
Specific gravity (at 20℃)
0.795
Halide content(%)
0
Flux Type
ORL0(IPC-J-STD-004A)
Application
Dipping
Purpose of Use
Terminal processing

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