Solder paste for super fine pitch and micro components

S3X70-M500-4
Sn 3.0Ag 0.5Cu

Fine particles melt in the air.

Uniformly spherical solder powder

The reason why graping often occurs while using fine particle solder paste is an increase in the amount of oxide layers due to a larger amount of fine particles printed. S3X70-M500-4 minimizes the amount of oxide layers by selecting fine and spherical solder powders under strict quality checks, in order to retain high meltability.

■Solder powder

Defined print shapes

Carefully selected spherical solder powder and specially prepared extremely slippery flux enable smooth detaching of solder paste from the mask even from narrow openings of 0.2 mm. The resultant print shapes are highly defined.

■Print Definition

Completely melts in air reflow

Generally expensive N2 reflow is applied when fine particle solder paste is used to counter a large amount of oxide layers. S3X70-M500-4 exhibits excellent melting properties even in air reflow, realizing high assembly quality and high cost benefit at the same time.

■Wettability (Reflow atmosphere : air)

Product Performance Table

Product Name
S3X70-M500-4
Product Category
Solder Paste
Composition
Sn 3.0Ag 0.5Cu
Melting Point(℃)
217-219
Particle Size(μm)
10-25
Viscosity(Pa.s)
220
Flux Content(%)
11.5
Halide content(%)
0
Flux Type
ROL0 (IPC J-STD-004A)
Characteristics
Application:Printing

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