Solder paste for PoP application

NT2 series
Sn 3.0Ag 0.5Cu

In pursuit of
Consistent joiny quality

Consistent transfer even under continual use

NT2 series achieved consistency in transfer amounts which is often a problem with PoP transferring.
There is little fluctuation in the transfer height even after lengthy use. The NT2 series assure consistent transfer amounts and reliable PoP applications.

■Retains stable transfer volume

Prevents defective joints due to component heat warp

During reflow, defective joints can be generated due to warping of the package and substrate that causes the detachment of paste from bumps and oxidation of surfaces.
The NT2 series have improved heat resistance and activity, preventing defective joints often observed in PoP applications.

■Cross section of the joint

Three different particle sizes

Three different solder particle sizes were prepared to meet demands for further downsizing and diversification.

■Transfer state by powder size

Product Performance Table

Product Name
NT2 series
Product Category
Solder Paste
Melting Point(℃)
Particle Size(μm)
70:10-25 / 811:5-20 / 812:1-20
Flux Content(%)
70:20.2 / 811:20.0 / 812:20.0
Halide content(%)
Flux Type
Shelf life (below 10℃) : Jar 3month Syringe 1month

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