Sn 3.0Ag 0.5Cu
In pursuit of
Consistent joiny quality
Consistent transfer even under continual use
NT2 series achieved consistency in transfer amounts which is often a problem with PoP transferring.
There is little fluctuation in the transfer height even after lengthy use. The NT2 series assure consistent transfer amounts and reliable PoP applications.
Prevents defective joints due to component heat warp
During reflow, defective joints can be generated due to warping of the package and substrate that causes the detachment of paste from bumps and oxidation of surfaces.
The NT2 series have improved heat resistance and activity, preventing defective joints often observed in PoP applications.
Three different particle sizes
Three different solder particle sizes were prepared to meet demands for further downsizing and diversification.
Product Performance Table
- Product Name
- NT2 series
- Product Category
- Solder Paste
- Melting Point(℃)
- Particle Size（μm）
- 70:10-25 / 811:5-20 / 812:1-20
- Flux Content(%)
- 70:20.2 / 811:20.0 / 812:20.0
- Halide content(%)
- Flux Type
- ROL0 (IPC J-STD-004A)
- Shelf life (below 10℃) : Jar 3month Syringe 1month