Sn 3.0Ag 0.5Cu
Preventing Solder Powder Degradation
Application of 0201/03015 Components and Future Projection
Currently, application of 0201/03015 size components is limited to mobile devices such as a blue tooth or GPS module.
In the future, miniaturization of electric device is expected to accelerate and the demand for micro size components can be increased.
Optimal Printability in Both Continuous and Intermittent Print at Fine Pitch
To achieve stable print at 0.1 mm aperture, Type 6 solder powder is selected.
Newly engineered solvent does not evaporate at room temperature thereby improving intermittent printability.
Stable Meltability Performance Based on Flux and Activator Design
Product Performance Table
- Product Name
- Product Category
- Solder Paste
- Sn 3.0Ag 0.5Cu
- Melting Point(℃)
- Particle Size（μm）
- Flux Content(%)
- Halide content(%)
- Flux Type
- ROL0(IPC J-STD-004B)