Low Flux Splattering Halogen Free Solder Paste

S3X58-HF912
Sn 3.0Ag 0.5Cu

Solution for the Splattering
in Reflow Soldering

Flux Splattering Test

Mechanism of Flux Splattering & Anti-Splattering Technique

In the conventional solder paste, flux gas gets generated once the solder starts melting, and the flux entrapped in solder
gets discharged by increased inner pressure of molten solder, splattering flux or flux with solder around.
S3X58-HF912, in contrast, forms a flux layer on the surface of the molten solder and prevents splattering of flux or flux with solder while soldering.

Flux Splattering Test

The conventional solder pastes requires high pre-heat temperature to evaporate volatile flux components
which helps reduce the splatters during the reflow.

S3X58-HF912 successfully conforms to various reflow profiles thereby eliminating the need to increase
the pre-heat temperature to prevent occurrence of the flux splatters during the reflow.

Product Performance Table

Product Name
S3X58-HF912
Product Category
Solder Paste
Composition
Sn 3.0Ag 0.5Cu
Melting Point(℃)
217-219
Particle Size（μm）
20-38
Viscosity（Pa.s）
190
Flux Content(%)
11.5
Halide content(%)
0
Flux Type
ROL0 (IPC J-STD-004A)

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