Reinforces Joint Strength of
such as CSP, BGA.
Reinforcement Material for Package Devices
JU-120EB is designed to provide improved features of repairability
and stability during storage and transportation without requiring chilled condition.
Superior T/C Resistance
CTE mismatch between PCB, solder alloy and component causes crack in solder joint.
Epoxy based adhesives in general, have a higher CTE than the solder alloy and PCB. Therefore their application may induce cracking in solder joint near the printed circuit board.
When the filler content is increased, it helps to decrease CTE, but increases the viscosity making material difficult to dispense.
JU-120EB has an unique combination of a stable viscosity and low CTE which makes it compatible with variety of solder alloys , PCBs and components.
Edge bond is required to be repairable after it gets cured.
In order to have the material repairable, it needs to be softened in cured condition after heat is applied.
But increase of the material fluidity tends to deteriorate the SIR because it allows the mobility of ionic substances.
JU-120EB has succeeded to make both easy repair ability and high SIR by carefully selecting the hardening agent and formulation technique.
Thermal Cycling Durability
・ Substrate : FR-4, OSP
・ Component : 1.0mmPitch BGA (SAC305 ball)
・ Mount condition : SAC305 solder paste Print thickness 120μm
・ Curing condition : 150 ºC x10min
・ T/C condition : -30/+80ºC 15 dwell x 500 cycles
Drop Impact Resistance
PCB : FR-4, OSP, t=1.0 (JEDEC:JESD22-B111)
Component : 196-pin BGA SAC305 ball
Soldering condition : Sn-Bi paste, T=120μm SnBi reflow profile
Test condition : Half sine wave, 1500Gx0.5msec
Product Performance Table
- Product Name
- Product Category
- Heat Curable SMT Adhesive
- Epoxy Based
- State / Color
- Paste / Black
- Shelf life (0-10℃)
- Below 10ºC, 6 months