Repairable Edge Bond for Joint Reinforcement


Reinforces Joint Strength of
Package Components,
such as CSP, BGA.

Reinforcement Material for Package Devices

JU-120EB is designed to provide improved features of repairability
and stability during storage and transportation without requiring chilled condition.

Superior T/C Resistance

■ Challenge
CTE mismatch between PCB, solder alloy and component causes crack in solder joint.
Epoxy based adhesives in general, have a higher CTE than the solder alloy and PCB. Therefore their application may induce cracking in solder joint near the printed circuit board.

■ Solution
When the filler content is increased, it helps to decrease CTE, but increases the viscosity making material difficult to dispense.
JU-120EB has an unique combination of a stable viscosity and low CTE which makes it compatible with variety of solder alloys , PCBs and components.

Repair Ability

■ Challenge
Edge bond is required to be repairable after it gets cured.

■ Solution
In order to have the material repairable, it needs to be softened in cured condition after heat is applied.
But increase of the material fluidity tends to deteriorate the SIR because it allows the mobility of ionic substances.
JU-120EB has succeeded to make both easy repair ability and high SIR by carefully selecting the hardening agent and formulation technique.

Thermal Cycling Durability

Test Condition
・ Substrate : FR-4, OSP
・ Component : 1.0mmPitch BGA (SAC305 ball)
・ Mount condition : SAC305 solder paste Print thickness 120μm
・ Curing condition : 150 ºC x10min
・ T/C condition : -30/+80ºC 15 dwell x 500 cycles

■ After 500 Cycles

Drop Impact Resistance

PCB : FR-4, OSP, t=1.0 (JEDEC:JESD22-B111)
Component : 196-pin BGA SAC305 ball
Soldering condition : Sn-Bi paste, T=120μm SnBi reflow profile
Test condition : Half sine wave, 1500Gx0.5msec

Product Performance Table

Product Name
Product Category
Heat Curable SMT Adhesive
Epoxy Based
State / Color
Paste / Black
Shelf life (0-10℃)
Below 10ºC, 6 months

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