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Ultra Low Void Lead Free Solder Paste
S3X58-G803
Sn 3.0Ag 0.5Cu

Ensures stable and ultra low voiding regardless of component type and reflow profiles
Concerns with Voiding
Voids remained inside the solder joint affect the joint quality in various aspects.

Flux Technique that Enables Drastic Reduction of Voids

Product Performance Table
- Product Name
- S3X58-G803
- Product Category
- Solder Paste
- Composition
- Sn 3.0Ag 0.5Cu
- Melting Point(℃)
- 217 - 219
- Particle Size(μm)
- 20-38
- Viscosity(Pa.s)
- 200
- Flux Content(%)
- 11.8
- Halide content(%)
- 0
- Flux Type
- ROL0(IPC J-STD-004)