Ultra Low Void Lead Free Solder Paste

S3X58-G803
Sn 3.0Ag 0.5Cu

Ensures stable and ultra low voiding regardless of component type and reflow profiles

Concerns with Voiding

Voids remained inside the solder joint affect the joint quality in various aspects.

Flux Technique that Enables Drastic Reduction of Voids

Product Performance Table

Product Name
S3X58-G803
Product Category
Solder Paste
Composition
Sn 3.0Ag 0.5Cu
Melting Point(℃)
217 - 219
Particle Size（μm）
20-38
Viscosity（Pa.s）
200
Flux Content(%)
11.8
Halide content(%)
0
Flux Type
ROL0（IPC J-STD-004）

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