Cleanable No Clean Solder Paste
  

S3X58-A230
S3X48-A230
Sn 3.0Ag 0.5Cu

Superb Cleanability for
Any Cleaning Agent.

Usable for either clean or no-clean

Careful selection and preparation of ingredients produced flux that exhibits high insulation reliability even without cleaning. If desired, it can be easily cleaned by a CFC-alternative cleaning agent.

■Voltage Applied SIR

Maintains high cleanability before and after reflow

Flux of S3X48-A230 can be easily cleaned before or after reflow. In addition to residue cleanability, in case of faulty printing the substrate can be easily cleaned, minimizing delays in the assembly process.

■Cleanliness Test

Overwhelmingly few solder balls

Trying to improve residue cleanability above a certain level inevitably restricts usable ingredients. Amid such restriction, S3X48-A230 exerts amazingly rapid activation effects and aggregates all molten solder droplets.

■Solder Balling Test

Product Performance Table

Product Name
S3X58-A230 / S3X48-A230
Product Category
Solder Paste
Composition
Sn 3.0Ag 0.5Cu
Melting Point(℃)
217-219
Particle Size(μm)
20-38 / 20-45
Viscosity(Pa.s)
210 / 170
Flux Content(%)
12.0
Halide content(%)
0.06
Flux Type
ROL0 (IPC J-STD-004A)

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