Sn 3.0Ag 0.5Cu
6-month shelf life at 25℃, inhibiting metallic salts.
New technology for room temperature storage
Chemical reactions between solder powders and flux occurring in solder paste at room temperature are minimized, which effectively eliminates issues such as thickening and enables long-term storage at room temperature.
Maintains viscosity in harsh temperature conditions
Improves workability and avoids quality changes during transportation
Room temperature storage eliminates concerns such as "quality change in continual use", "wait period after taking out of the refrigerator", and "degradation for forgetting to put into a refrigerator". Significant improvement in production efficiency and higher cost benefits by reducing waste amount can be achieved.
Product Performance Table
- Product Name
- S3X58-M406ECO / S3X48-M406ECO
- Product Category
- Solder Paste
- Melting Point(℃)
- Particle Size（μm）
- 20-38 / 20-45
- Flux Content(%)
- Halide content(%)
- Flux Type
- ROL0 (IPC J-STD-004)