Multi-feature Halogen-free LF Solder Paste

Sn 3.0Ag 0.5Cu

Versatile Ever.
The Definitive Solder Paste,

A Solution to Just About All Soldering Requirements

S3X58-HF1100, by adopting newly developed techniques through our expertise and experiences, has gained excellent results in all soldering features such as wetting, ICT testing, flux splattering, voiding, printing, tackiness, electrical reliability, halogen free, etc.

Powerful Wetting Technique Advances Solder Joint Reliability

S3X58-HF1100 has applied a newly engineered flux technology in which solder particles are protected from being oxidized by an easy-to-remove protective layer and the antioxidant in the flux suppresses continued oxidation over time.
Such effects help save the amount of activator needed for oxidation prevention, as well as the activator capping technique which allows maximum activation strength when the solder is molten.

【 Solder spreading to Nickel Silver substrate 】

Flux Coagulation Technique Improves First Pass Yield

The flux formulation of S3X58-HF1100 solder paste is specifically designed to exhibit enhanced flux coagulation at the time when the solder starts to melt.Instant coagulation and evacuation of the liquified flux when the solder gets molten, brings about various benefits in soldering performance such as reduction in voiding rate and flux splattering, and improved wetting and ICT properties.

【 Splatter test 】

Want to know more? You can find more information on S3X58-HF1100 by clicking on the link below:

In Focus - S3X58-HF1100

Take a quick look at the product.

Product Performance Table

Product Name
Product Category
Solder Paste
Sn 3.0Ag 0.5Cu
Melting Point(℃)
217 - 219
Particle Size(μm)
20 - 38
Flux Content(%)
Halide content(%)
Flux Type

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