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- A New Material Solution for On-Board Automotive Electronics
A New Material Solution for On-Board Automotive Electronics
2012.12.21
Joint Cracking the Problem?
As the European Restriction of Hazardous Substances (RoHS) directives come into force in July 2006, the transition to lead-free solder is being made at an increasingly rapid pace. Many manufacturers have already adopted Sn-Ag-Cu (SAC) type solder as a representative lead-free solder for consumer appliance production.The mechanical properties of SAC solder differ greatly from those of conventional Sn-Pb solder. At the beginning of lead-free substitution, SAC displayed high creep strength. It was believed that this would be sufficiently effective for soldering reliability, but as many users conducted reliability testsÍÂnd as it was actually used for products and market data became availableÍÄoncerns about its durability began to be raised. It is now known that cracks in SAC joints progress quickly.
After many years of working with automotive suppliers and manufacturers, we have developed a higher reliability lead-free solder designed to stand up to the more severe environments to which on-board automotive electronics are exposed. This article details our solution, for the first time, to the North American market.
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