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Void Occurrence in Relation to the Surface Finish of Power Devices

2021.8.10

Research and development of power devices using new semiconductor materials, such as SiC or GaN have been progressing rapidly.
A power device solder joint is larger than any solder joints formed in the SMT industry in general, wich makes it prone to void occurrence.

In this article, we will discuss void occurrence trends with different combinations of the E12, Koki developed solder paste for formic acid reflow soldering, and the main surface finishes used in power device components based on evaluations using replicated die bonded solder joints and heat sink joints.


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