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S3X58-CF100-2
Sn 3.0Ag 0.5Cu
![](/src/upload/main/2022/07/s3x58_cf100_2_main.png)
Highly reliable solder paste with "Crack-Free residue" Technology
Suppresses ion migration
By adopting special resin into the flux, the residue remains flexible at a wider temperature range.
Cracking during thermal cycling is suppressed, and ion migration due to condensation is significantly reduced.
■Dew condensation cycle test
![](/src/upload/item/2022/07/s3x58_cf100_2_01_en1.png)
No residue washing or coating required
S3X58-CF100-2 crack-free flux residue acts as a coating and prevents condensation and contamination at joints.
Therefore, residue washing or coating is not needed.
The number of processes will be reduced, and significant cost benefit can be anticipated.
■ Flux residue after thermal cycling
![](/src/upload/item/2022/07/s3x58_cf100_2_02_en.png)
Passed various insulation tests for automotives
In addition to typical test standards, various insulation tests specified by automotive component manufacturers has been carefully conducted.
Through these tests, S3X58-CF100-2 has proven that crack-free residue achieves high electrical reliability.
Voltage applied SIR
![](/src/upload/item/2022/07/s3x58_cf100_2_03_en.png)
Product Performance Table
- Product Name
- S3X58-CF100-2
- Product Category
- Solder Paste
- Melting Point(℃)
- 217-219
- Particle Size(μm)
- 20-38
- Viscosity(Pa.s)
- 190
- Flux Content(%)
- 11.2
- Halide content(%)
- 0
- Flux Type
- ROL1 (IPC J-STD-004)