Applicable for air reflow – crack free flux residue solder paste

Sn 3.0Ag 0.5Cu

Highly reliable solder paste with "Crack-Free residue" Technology

Suppresses ion migration

By adopting special resin into the flux, the residue remains flexible at a wider temperature range. Cracking during thermal cycling is suppressed, and ion migration due to condensation is significantly reduced.

■Dew condensation cycle test

Significantly increases ICT first run rate

Soft residue containing special resin reduces adsorption of flux residue onto test pins and contributes to the improvement of the ICT first run rate and application efficiencies.

■Pin testability

Passed various insulation tests for automotives

In addition to typical test standards, various insulation tests specified by automotive component manufacturers has been carefully conducted. Through these tests, S3X58-CF100-2 has proven that crack-free residue achieves high electrical reliability.

Voltage applied SIR

Product Performance Table

Product Name
Product Category
Solder Paste
Melting Point(℃)
Particle Size(μm)
Flux Content(%)
Halide content(%)
Flux Type
ROL0 (IPC J-STD-004)

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