High reliability alloy flux cored solder wire

Sn 3.5Ag 0.5Bi 6.0In 0.8Cu

For highly reliable repaired solder joints

Highly reliable joints ideal for automotives etc.

Indium is added at the ideal rate of 6% to improve strength and to prevent any deterioration. High joint reliability can be achieved even under extreme use environments such as automotive electronics, aviation, and industrial equipment.

■After thermalcycling (-40/+125℃×1500cycles)

Thermal fatigue resistance superior to SAC305

Joint strength and durability of Bi-/In-added SB6NX alloy surpasses that of conventional SAC305. SB6NX exerts its strength especially in heat cycle stress resistance.

■Shear strength(-40/+125℃ 30min, 5025 chip component)

Various SB6NX alloy series

The lineup of SB6N series includes printing solder paste SB6NX58-M500SI and dispensing solder paste SB6NX58-M500SID, in addition to flux-cored wire solder.

Product Performance Table

Product Name
Product Category
Flux Cored Solder Wire
Melting Point(℃)
Flux Content(%)
Halide content(%)
< 0.01
Flux Type
ROL0 (IPC J-STD-004)
Diameter(mm φ)
0.3, 0.5, 0.6, 0.8, 1.0 ,1.2

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