Sn 3.0Ag 0.5Cu
Solder the right "Spot".Not "Area" soldering.
Uniformly spherical solder powder
The reason why graping often occurs while using fine particle solder paste is an increase in the amount of oxide layers due to a larger amount of fine particles printed. S3X70-M500D minimizes the amount of oxide layers by selecting fine and spherical solder powders under strict quality checks, in order to retain high meltability.
Consistent deposit shape even in long-term uses
Carefully selected solder powder and flux of highly consistent viscosity in continual use maintain fine print shapes even in long-term uses.
Superbly low voiding for any component
S3X70-M500D is designed to maintain its activity for a long period of time. During reflow, by removing voids in a long span, S3X70-M500D realizes low voiding for any component.
Product Performance Table
- Product Name
- Product Category
- Solder Paste
- Sn 3.0Ag 0.5Cu
- Melting Point(℃)
- Particle Size（μm）
- Flux Content(%)
- Halide content(%)
- Flux Type
- ROL0 (IPC J-STD-004A)