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High durability alloy solder paste
SB6N58-M500SI
Sn 3.5Ag 0.5Bi 6.0ln

Highly thermal stress resistant alloy with indium
Increasing demand for high thermal stress durability
For PCBs exposed to severe temperature fluctuation, long term durable alloys are required to counter thermal cycling induced stress.
■ Mechanism of crack occurrence by thermal cycling stress

Absorption of mechanical stress by addition of indium
SB6N58 M500S1 adopted 6% indium to balance and optimize thermal stress and deformation character̶ istics, which could occur if excessively added.
■ Difference of deformation temperature by Indium content

Remarkable joint reliability
■ Shear strength ( 40⇔ 150°C for 30min. each) & Cross sectional view (After 1500 cycles)

Product Performance Table
- Product Name
- SB6N58-M500SI
- Product Category
- Solder Paste
- Composition
- Sn 3.5Ag 0.5Bi 6.0ln
- Melting Point(℃)
- 202-210
- Particle Size(μm)
- 20-38
- Viscosity(Pa.s)
- 200
- Flux Content(%)
- 11.1
- Halide content(%)
- 0
- Flux Type
- ROL0
- Characteristics
- for Dispense : SB6N58-M500SID