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- JU-110-3
REACH compliant SMT adhesive for dispensing
JU-110-3
![](/src/upload/main/2020/05/ju_110_3_main.png)
Applicable to 1005 chip components
Stable and tall deposits ensure contact even with 1005 chip components
JU-110-3 ensures excellent shape retention, enabling continual application of tall print deposits.
Therefore, contact with surface-mounted components of any shape is achieved,
improving reliability of the wave soldering process.
![](/src/upload/item/2020/06/ju_110_3_1.png)
Resistant to heat slump
JU-110-3 is resistant against heat slump, maintaining the height of deposits throughout the process.
The height of deposits and contact with surface-mounted components are maintained even during heating,
securely holding the components in place.
![](/src/upload/item/2020/05/ju_110_3_2.png)
Compliant to REACH regulation
JU-110-3 has significantly reduced the content of one of the substances of very high concern (SVHC) as regulated by the European Chemical Agency (ECHA), and is compliant to the REACH regulation.
![](/src/upload/item/2020/05/ju_110_3_3.jpg)
Product Performance Table
- Product Name
- JU-110-3
- Product Category
- Heat Curable SMT Adhesive
- State / Color
- Paste, red
- Tg(℃)
- 90
- Curing condition
- 130ºC, >60sec.
- Shelf life (0-10℃)
- 6 months