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S1XBIG58-M650-7
Sn 1.1Ag 0.7Cu 1.8Bi+Ni

Testing Probe Stays Clean.
High ICT first pass yield
S1XBIG58-M650-7 prevents the buildup of thick and sticky flux residue over the solder joint, which helps the testing probe to get the accurate readings to improve the first pass rate.
■Resistance between Probe and PCB

Superior wetting ability prevents voiding
For smaller components such as QFNs, micro BGA and LGA, bigger voids could occupy majority of the pad area thus creating a possible weak link for failure. S1XBIG58-M650-7 has specially designed flux to effectively reduce the amount of gas generated thereby minimize the amount of voids.
■Solder joint diagram (After 1500 cycles of -30 +/-80℃)

"Halogen-free"
addressing the environment
One keyword of environmental measures is "halogen-free"; these days companies demand final products to be halogen-free. Halogen-free S1XBIG58-M650-7 meets such demands while providing both reliability and workability.

Product Performance Table
- Product Name
- S1XBIG58-M650-7
- Product Category
- Solder Paste
- Melting Point(℃)
- 211-223
- Particle Size(μm)
- 20-38
- Viscosity(Pa.s)
- 200
- Flux Content(%)
- 11.2
- Halide content(%)
- 0
- Flux Type
- 200