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S1XBIG58-M650-7
Sn 1.1Ag 0.7Cu 1.8Bi+Ni
![](/src/upload/main/2016/09/img_s1xbig_m650_7_main_en.jpg)
Testing Probe Stays Clean.
High ICT first pass yield
S1XBIG58-M650-7 prevents the buildup of thick and sticky flux residue over the solder joint,
which helps the testing probe to get the accurate readings to improve the first pass rate.
■ Resistance between Probe and PCB
![](/src/upload/item/2016/09/img_s1xbig58_m650_7_1_en.jpg)
Superior wetting ability prevents voiding
For smaller components such as QFNs, micro BGA and LGA, bigger voids could occupy majority of the pad area thus creating a possible weak link for failure. S1XBIG58-M650-7 has specially designed flux to effectively reduce the amount of gas generated thereby minimize the amount of voids.
■ Solder joint diagram (After 1500 cycles of -30 +/-80℃)
![](/src/upload/item/2016/09/img_s1xbig58_m650_7_2_en.jpg)
"Halogen-free"
addressing the environment
One keyword of environmental measures is "halogen-free"; these days companies demand final products to be halogen-free.
Halogen-free S1XBIG58-M650-7 meets such demands while providing both reliability and workability.
![](/src/upload/item/2016/09/img_item_03_031.jpg)
Product Performance Table
- Product Name
- S1XBIG58-M650-7
- Product Category
- Solder Paste
- Composition
- Sn 1.1Ag 0.7Cu 1.8Bi+Ni
- Melting Point(℃)
- 211-223
- Particle Size(μm)
- 20-38
- Viscosity(Pa.s)
- 200
- Flux Content(%)
- 11.2
- Halide content(%)
- 0
- Flux Type
- ROL0