In-containing high reliability alloy solder paste recommended for ENIG finish

Sn 3.5Ag 0.5Bi 6.0In 0.8Cu

Excellent Durability Against Heat Cycle Stress

Ideal for extreme environments

SAC type solder joint cannot comply with longer product life requirement for such application that are exposed to significant higher temperatures. To make a much stronger, fatigue resistant joint possible, solid solution strengthening of Sn crystal lattice is facilitated by addition of In and Bi.

■Elements (Bi,In) added

Recommended for ENIG finish

In ENIG finish, Sn-Ni IMC layer thickens and along with concentration of P causes the joint interface brittle.By adding Ni-compatible Cu, SB6NX forms a Ni barrier layer and effectively prevents the thickening of Sn-Ni IMC layer, realizing high joint reliability with ENIG finish.

■Effect of added Cu

For the better joint reliability

In comparison with SAC305, SB6NX has better elongation property and is less prone to deformation. That helps to prevent propagation of crack at the solder joint in thermal cycling. As found below, SB6NX shows much higher sheer strength than SAC305 with ENIG and OSP substrate alike.

■Stress strength after T/C

Product Performance Table

Product Name
Product Category
Solder Paste
Sn 3.5Ag 0.5Bi 6.0In 0.8Cu
Melting Point(℃)
202 - 204
Particle Size(μm)
200 / 120( for Dispense)
Flux Content(%)
11.0 / 13.0( for Dispense)
Halide content(%)
Flux Type
for Dispense:SB6NX58-M500SID

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