Sn 3.5Ag 0.5Bi 6.0In
Highly thermal stress resistant
Halogen free (ROL0) by IPC J-STD-004B
Increasing demand for high thermal stress
For PCBs exposed to severe temperature fluctuation,
long term durable alloys are required to counter thermal cycling induced stress.
Solid solution strengthening in Sn phase
Indium does not form compound with Sn but replace the Sn atom (from solid solution).
As atomic radius of In is significantly larger than Sn, it generates strain in atomic structure
and prevent Sn atom dislocation.
Activator technique enables viscosity stability,
powerful wetting, and high SIR
Product Performance Table
- Product Name
- Product Category
- Solder Paste
- Sn 3.5Ag 0.5Bi 6.0In
- Melting Point(℃)
- Particle Size（μm）
- 20 - 38
- Flux Content(%)
- Halide content(%)
- Flux Type