In-containing high reliability alloy halogen-free solder paste recommended for ENIG finish

Sn 3.5Ag 0.5Bi 6.0In 0.8Cu

Excellent Durability
Against Heat Cycle Stress

Ideal for extreme environments

SAC type solder joint cannot comply with longer product life requirement for such application that are exposed to significant higher temperatures. To make a much stronger, fatigue resistant joint possible, solid solution strengthening of Sn crystal lattice is facilitated by addition of In and Bi.

■Elements (Bi,In) added

Recommended for ENIG finish

In ENIG finish, Sn-Ni IMC layer thickens and along with concentration of P causes the joint interface brittle.By adding Ni-compatible Cu, SB6NX forms a Ni barrier layer and effectively prevents the thickening of Sn-Ni IMC layer, realizing high joint reliability with ENIG finish.

【 Effect of added Cu 】

Activator technique enables viscosity stability,
powerful wetting, and high SIR

【 Activation state (image) 】

Product Performance Table

Product Name
Product Category
Solder Paste
Sn 3.5Ag 0.5Bi 6.0In 0.8Cu
Melting Point(℃)
202 - 204
Particle Size(μm)
200 / 120( for Dispense)
Flux Content(%)
10.8 / 12.5( for Dispense)
Halide content(%)
Flux Type
for Dispense : SB6NX58-HF350D

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