Multi-feature High Reliability (0.1Ag) Lead-free Solder paste

Sn 0.1Ag 0.7Cu 1.6Bi +N

Achieved joint reliability
superior to SAC305

Maintains thermal-fatigue resistance over a long duration

【 Strengthening by fine precipitates: Ni 】

Strengthening method by preventing the Sn crystal grain structure from coarsening
by forming fine precipitates of high melting point intermetallic compounds
which prevent dislocations from propagating beyond the grain boundaries.

【 Strengthening by solid solution: Bi 】

Bi, which has larger atomic diameter than Sn is scattered in the Sn lattice and forms distortions
within the matrix to prevent the propagation and accumulation of the dislocation.

Sn crystal grain structure is strengthened by partially replacing the Sn atoms with Bi atoms and helps
to resist deformation by preventing the dislocations from propagating.

S01XBIG achieves less strength loss against thermomechanical stress and
prevents deformation of the joint structure and growth of coarse IMC compared with SAC305.

■Above figure:Shear strength -30/+80°C, Lower figure:Cross-Section after thermal cycle test

The only difference from SAC305 is the "low cost"

A very small amount of two modifying elements Bi and Ni are added. Different effects from these elements achieved strong and easy-to-use low Ag solder that is equivalent to or superior to SAC305, such as the melting point, thermal resistance, and time-dependent change in the crystal structure.

A Solution to Just About All Soldering Requirements

S01XBIG58-HF1100-3, by adopting newly developed techniques through our expertise and experiences, has gained excellent results
in all soldering features such as wetting, flux splattering, voiding, printing, tackiness, electrical reliability, halogen free, etc

Product Performance Table

Product Name
Product Category
Solder Paste
Sn 0.1Ag 0.7Cu 1.6Bi +Ni
Melting Point(℃)
211 - 227
Particle Size(μm)
Flux Content(%)
Halide content(%)
Flux Type
IPC J-STD-004B and 004C

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