Sn 3.0Ag 0.5Cu
Crack-Free residue technology for reliable auto-applications
No residue washing or coating required
GSP's crack-free flux residue acts as a coating and prevents condensation and contamination at joints. Therefore, residue washing or coating is not needed. The number of processes will be reduced, and significant cost benefit can be anticipated.
Wets lead ends
GSP exerts excellent wettability even to lead ends which are generally not plated and considered poorly wettable and contributes to improving the first time quality.
Reliable insulation in condensing environments
GSP maintains excellent insulation reliability in condensing tests conducted after thermal cycling tests (-40/+125ºC x 1000cycles). GSP's crack-free flux residue prevents moisture absorption to joints, ensuring superb electrical reliability.
Product Performance Table
- Product Name
- Product Category
- Solder Paste
- Melting Point(℃)
- Particle Size（μm）
- Flux Content(%)
- Halide content(%)
- Flux Type
- ROM1 (IPC J-STD-004)