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Solder paste developed in collaboration with TOYOTA Corporation
GSP
Sn 3.0Ag 0.5Cu
![](/src/upload/main/2017/09/gsp_main.png)
Crack-Free residue technology for reliable auto-applications
No residue washing or coating required
GSP's crack-free flux residue acts as a coating and prevents condensation and contamination at joints. Therefore, residue washing or coating is not needed. The number of processes will be reduced, and significant cost benefit can be anticipated.
■Flux residue after thermal cycling
![](/src/upload/item/2018/03/img_item_19_01_en.jpg)
Wets lead ends
GSP exerts excellent wettability even to lead ends which are generally not plated and considered poorly wettable and contributes to improving the first time quality.
■Wetting to the lead ends
![](/src/upload/item/2018/03/img_item_19_02_en.jpg)
Reliable insulation in condensing environments
GSP maintains excellent insulation reliability in condensing tests conducted after thermal cycling tests (-40/+125ºC x 1000cycles). GSP's crack-free flux residue prevents moisture absorption to joints, ensuring superb electrical reliability.
![](/src/upload/item/2017/09/img_item_19_03_en.jpg)
Product Performance Table
- Product Name
- GSP
- Product Category
- Solder Paste
- Composition
- Sn 3.0Ag 0.5Cu
- Melting Point(℃)
- 217-219
- Particle Size(μm)
- 20-38
- Viscosity(Pa.s)
- 160 / 100(for Dispense)
- Flux Content(%)
- 10.9 / 13.0(for Dispense)
- Halide content(%)
- 0.06
- Flux Type
- ROM1 (IPC J-STD-004)
- Characteristics
- for Dispense : GSP-D