Halogen Free Pin Testable Solder Paste

S3X58-M650-7
Sn 3.0Ag 0.5Cu

Testing Probe Stays Clean.

Good inspection properties

S3X58-M650-7 prevents the buildup of thick and sticky flux residue over the solder joint, which helps the testing probe to get the accurate readings to improve the first pass rate.

■Resistance between Probe and PCB

Superior wetting ability prevents voiding

For smaller components such as QFNs, micro BGA and LGA, bigger voids could occupy majority of the pad area thus creating a possible weak link for failure. S3X58-M650-7 has specially designed flux to effectively reduce the amount of gas generated thereby minimize the amount of voids.

■X-ray image : LGA

"Halogen-free" – addressing the environment

One keyword of environmental measures is "halogen-free"; these days companies demand final products to be halogen-free. Halogen-free S3X58-M650-7 meets such demands while providing both reliability and workability.

Product Performance Table

Product Name
S3X58-M650-7
Product Category
Solder Paste
Composition
Sn 3.0Ag 0.5Cu
Melting Point(℃)
217-219
Particle Size(μm)
20-38
Viscosity(Pa.s)
200
Flux Content(%)
11.5
Halide content(%)
0
Flux Type
ROL0 (IPC J-STD-004B)

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