Sn 3.0Ag 0.5Cu
Applicable to 0402 chip component
with AIR reflow atmosphere.
Reduces defects during stencil printing
with a newly developed lubrication technique
S3X70-G811 adopts a type of non-volatile solvent as its primary constituent,
and can keep itself from drying when the paste is left idle.
A better print-to-pause property results,
ensuring a consistent printability and workability even after a 60-min. pause.
[ Print-to-pause property ]
Evaluate transfer rate of printed solder paste volume before and after leaving on a stencil.
・Substrate: FR-4 ・Stencil thickness: 0.08mm (laser cut)
・Stencil aperture: 0.18mm dia. Pattern ・Squeegee angle: 60°
Excellent meltability and wettability
on micro-patterns in air reflow
Although the size of the S3X70-G811 solder particle is Type 5,
the product exhibits good meltability and wettability without a Nitrogen atmosphere.
This has been enabled by a newly engineered flux formulation optimized for Type 5 powders.
[ Reflow test in Air atmosphere ]
・Substrate: FR-4 ・Stencil thickness: 0.08mm
・Stencil aperture: 0.175mm dia. , 0402R
・Aperture ratio: 100% ・Pad surface finish: Cu-OSP
・Heating method: Hot air reflow ・Reflow atmosphere: Air
Reduced voids with various board surface
In addition to having good melting properties,
S3X70-G811 displays excellent wetting performance on various board surface finishes.
This helps the molten solder to quickly push out flux elements,
and reduces the occurrence of voids as a result.
Product Performance Table
- Product Name
- Product Category
- Solder Paste
- Sn 3.0Ag 0.5Cu
- Melting Point(℃)
- Particle Size（μm）
- 200 ± 30
- Flux Content(%)
- 12.0 ± 1.0
- Halide content(%)
- Flux Type
- ROL0 (IPC J-STD-004A)